Package structure with reinforced element and formation method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShin-Puu JENG, Po-Yao LIN, Shuo-Mao CHEN, Chia-Hsiang LIN
Life of this patent
Estimating the term…
Abstract
A package structure and a formation method of a package structure are provided. The method includes forming multiple conductive vias in a carrier substrate and forming a redistribution structure over the carrier substrate. The redistribution structure has multiple polymer-containing layers and multiple conductive features. The method also includes disposing multiple chip structures over the redistribution structure. The method further includes bonding the carrier substrate to a package structure.
Claims20
A method for forming a package structure, comprising:
- forming a plurality of conductive structures in a carrier substrate;
- forming a redistribution structure over the carrier substrate, wherein the redistribution structure has a plurality of polymer-containing layers and a plurality of conductive features;
- bonding a plurality of chip structures over the redistribution structure;
- forming a protective layer over the redistribution structure to surround the chip structures;
- and
- forming a plurality of conductive connectors over a surface of the carrier substrate, wherein the carrier substrate is between the redistribution structure and the conductive connectors.
A method for forming a package structure, comprising:
- forming a plurality of conductive vias in a carrier substrate;
- forming a redistribution structure over the carrier substrate, wherein the redistribution structure has a plurality of polymer-containing layers and a plurality of conductive features;
- disposing a plurality of chip structures over the redistribution structure;
- and
- bonding the carrier substrate to a package structure.
A package structure, comprising:
- a reinforced plate;
- a plurality of conductive structures penetrating through the reinforced plate;
- a redistribution structure over the reinforced plate, wherein the redistribution structure comprises a plurality of polymer-containing layers and a plurality of conductive features;
- a plurality of chip structures over the redistribution structure;
- a protective layer surrounding the chip structures;
- and
- a plurality of conductive connectors below a bottom surface of the reinforced plate, wherein the reinforced plate is between the redistribution structure and the conductive connectors.
Dependencies are inferred from the claim text.