Embedded packaging structure having shielding cavity and manufacturing method thereof

A manufacturing method for an embedded package structure having a shielding cavity, comprising the following steps:

• (A) making a frame having a through hollow cavity, wherein the frame comprises a polymer dielectric and a shielding Cu pillar embedded in the polymer dielectric and surrounding the through hollow cavity;
• (B) placing a device into the through hollow cavity and filling a packaging material to form a first insulating layer;
• (C) applying a polymer dielectric onto a first surface of the first insulating layer to form a second insulating layer;
• (D) forming a hole on the second insulating layer to reveal a first end face of the shielding Cu pillar and a terminal of the device, while retaining the polymer dielectric in a predetermined position of a signal line leading-out opening;
• (E) forming a signal line, connected with the terminal of the device, on the second insulating layer, wherein the signal line passes through the position of the signal line leading-out opening;
• (F) performing layer building up from the first end face of the shielding Cu pillar such that it extends beyond the second insulating layer;
• (G) applying a polymer dielectric onto the shielding Cu pillar to form a third insulating layer;
• (H) thinning the first and third insulating layers to reveal the first and second end faces of the shielding Cu pillar;
• and
• (I) forming first and second wiring layers on the third and first insulating layers wherein the first and second wiring layers cover the first and second end faces of the shielding Cu pillar and are electrically connected with the shielding Cu pillar.