Module and method of manufacturing the same

A module comprising:

• a substrate having a main surface;
• a component mounted on the main surface of the substrate;
• a sealing resin disposed to cover the main surface and the component;
• and
• a shield film covering at least an upper surface of the sealing resin and that includes a conductive layer, a first protective layer covering the conductive layer, and a second protective layer covering the first protective layer,
• wherein the first protective layer comprises a recess that exposes the sealing resin to define a marking section, and the second protective layer includes a first region that covers the first protective layer and a second region that covers the recess.

A method of manufacturing a module, the method comprising:

• preparing a collective substrate;
• mounting a component on a main surface of the collective substrate;
• disposing a sealing resin to cover the main surface and the component;
• cutting the collective substrate into a plurality of module blanks;
• forming a conductive layer on each of the plurality of module blanks to cover the sealing resin;
• forming a first protective layer on each of the plurality of module blanks to cover the conductive layer;
• forming a marking section by irradiating an upper surface of the first protective layer with a laser beam;
• and
• forming a second protective layer to cover the upper surface of the first protective layer and the marking section.