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US 2022/0045012 A1Published application
Method for preparing semiconductor package structure
AssigneeNanya Technology Corporation
InventorSHING-YIH SHIH
Life of this patent
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Abstract
The present disclosure provides a method for preparing a semiconductor package structure. The method includes the following steps. A first die is provided. A second die including a plurality of first conductors is bonded to the first die. A plurality of second conductors are disposed on the first die. A molding is disposed to encapsulate the first die, the second die and the plurality of second conductors. An RDL is disposed on the second die and the molding. A plurality of connecting structures are disposed on the RDL.
Claims10
A method for preparing a semiconductor package structure, comprising:
- providing a first die;
- bonding a second die to the first die, wherein the second die comprises a plurality of first conductors;
- disposing a plurality of second conductors on the first die;
- disposing a molding to encapsulate the first die, the second die and the plurality of second conductors;
- disposing a redistribution layer (RDL) on the second die and the molding;
- and
- disposing a plurality of connecting structures on the RDL.
4 more elements
Dependencies are inferred from the claim text.