Semiconductor package having die pad with cooling fins

A method, comprising:

• forming a plurality of recesses in a first surface of a die pad to form a plurality of cooling fins, wherein the plurality of cooling fins alternate between respective pairs of the plurality of recesses;
• coupling a semiconductor die to a second surface of the die pad, the second surface being opposite the first surface;
• electrically coupling the semiconductor die to a plurality of leads;
• and
• encapsulating the semiconductor die in a packaging material to form a semiconductor package,
• wherein the semiconductor package has an outer coplanar surface that includes the packaging material, surfaces of the plurality of cooling fins, and surfaces of the plurality of leads.

A method of forming a semiconductor package, the method comprising:

• forming a plurality of recesses in a first surface of a die pad to form one or more cooling fins;
• coupling a semiconductor die to a second surface of the die pad;
• electrically coupling the semiconductor die to a plurality of leads;
• and
• encapsulating the semiconductor die in a packaging material to form the semiconductor package.