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US 2022/0044988 A1Published application
Soldering structure and power module comprising the same
AssigneesHyundai Motor Company, Kia Corporation
InventorsJun Hee PARK, Nam Sik KONG, Hyun Koo LEE
Life of this patent
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Abstract
A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.
Claims19
A soldering structure comprising:
- a component to be soldered;
- and
- a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.
A power module comprising:
- a component to be soldered;
- and
- a first substrate including a first metal layer, a dielectric layer and a second metal layer,
- wherein the first metal layer incudes an upper surface having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area,
- wherein the dielectric layer is bonded to a lower surface of the first metal layer and
- wherein the second metal layer is bonded to a lower surface of the dielectric layer.
3 more elements
Dependencies are inferred from the claim text.