Thermal conductive silicone composition and semiconductor device

A thermal conductive silicone composition comprising:

• (A) 100 parts by mass of an organopolysiloxane that has a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and is represented by the following average composition formula (1)
• R1aSiO(4-a)/2 (1)
• wherein R1 represents a hydrogen atom, a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms or a hydroxy group, and a represents a number satisfying 1.8≤a≤2.2;
• (B) a silver powder having a tap density of not lower than 3.0 g/cm3, a specific surface area of not larger than 2.0 m2/g and an aspect ratio of 1 to 30, the component (B) being in an amount of 300 to 11,000 parts by mass per 100 parts by mass of the component (A);
• (C) an elemental gallium and/or gallium alloy having a melting point of 0 to 70° C., the component (C) being in an amount of 1 to 1,200 parts by mass per 100 parts by mass of the component (A) and present at a mass ratio [Component (C)/{Component (B)+Component (C)}] of 0.001 to 0.1;
• and
• (D) a catalyst selected from the group consisting of a platinum-based catalyst, an organic peroxide and a catalyst for condensation reaction, the component (D) being in a catalytic amount.