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US 2022/0044977 A1Published application
Semiconductor device and manufacturing method for semiconductor device
AssigneeMitsubishi Electric Corporation
InventorYasutaka SHIMIZU
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Abstract
A semiconductor device includes a case enclosing a region where a semiconductor element as a component of an electric circuit exists. A resin part is fixed to an inside of the case in contact with the region. The resin part is provided with a conductive film, which is a part of the electric circuit. The conductive film is provided in the resin part so that the conductive film comes into contact with the region.
Claims1
A manufacturing method for a semiconductor device
- the semiconductor device comprising a case that encloses a region where at least a first member as a component of an electric circuit exists,
- wherein
- a resin part made of resin is fixed to an inside of the case, the inside being in contact with the region,
- the resin part is provided with a conductive film, which is a part of the electric circuit,
- the conductive film is provided in the resin part so that the conductive film comes into contact with the region, and
- an electrode is further fixed to the inside of the case,
- the manufacturing method comprising a step of fixing the resin part and the electrode to the inside of the case by insert molding.
4 more elements
Dependencies are inferred from the claim text.