Mainframe-less wafer transfer platform for wafer processing modules

A loadlock in a processing tool for implementing hybrid laser and plasma dicing of a substrate, comprising:

• an enclosure, wherein a first door is on a first side of the enclosure and a second door is on a second side of the enclosure that is opposite from the first side;
• a linear actuator in the enclosure, wherein the linear actuator extends out the second door when extended;
• and
• an end effector attached to the linear actuator.

A plasma laser dicing tool for dicing of a substrate, comprising:

• a transfer module, wherein the transfer module comprises a track robot for handling the substrate;
• a laser module attached to the transfer module, wherein the track robot is configured to insert and remove the substrate from the laser module;
• a first loadlock attached to the transfer module, wherein the first loadlock comprises a first linear transfer system for handling the substrate;
• a first processing chamber attached to the first loadlock, wherein the first linear transfer system of the first loadlock is configured to insert and remove the substrate from the first processing chamber;
• a second loadlock attached to the transfer module, wherein the second loadlock comprises a second linear transfer system for handling the substrate;
• and
• a second processing chamber attached to the second loadlock, wherein the second linear transfer system of the second loadlock is configured to insert and remove the substrate from the second processing chamber.