Non-contact clean module

A wafer gripping device comprising:

• a catch cup comprising a wall that has an annular inner surface defining a processing region;
• a gripper assembly configured to support a wafer in a vertical orientation, the gripper assembly comprising:
• a first plate assembly;
• and
• a second plate assembly comprising a plurality of gripping pins, each of the plurality of gripping pins configured to be:
• positioned a first distance from a central axis of the wafer gripping device based on the second plate assembly being positioned a second distance from the first plate assembly, wherein each of the plurality of gripping pins is configured to contact the edge of the wafer and hold the wafer in the vertical orientation when positioned the first distance from the central axis and in the processing region;
• and
• positioned a third distance from the central axis based on the second plate assembly being positioned a fourth distance from the first plate assembly, wherein the third distance is greater than the first distance, and the fourth distance is greater than the second distance;
• and
• a drive motor configured to impart horizontal motion to at least one of the first plate assembly and the second plate assembly to position the second plate assembly the first distance and the second distance from the first plate assembly.

A method for cleaning a wafer in a cleaning module comprising a wafer gripping device, the method comprising:

• positioning a gripper assembly in a loading position, wherein positioning the gripper assembly in the loading position comprises moving a first plate assembly of the gripper assembly away from a second plate assembly of the gripper assembly, and causes:
• the first plate assembly to be positioned closer to an annular inner surface of a catch cup of the wafer gripping device that has an angled portion that is symmetric about a central axis of the wafer gripping device, and
• a plurality of gripping pins of the second plate assembly to be moved to a position that is a first distance from the central axis;
• positioning the gripper assembly in a cleaning position, wherein positioning the gripper assembly in cleaning position comprises moving the first plate assembly towards the second plate assembly, and causes:
• the plurality of gripping pins to be positioned a second distance from the central axis so as to grip an edge of the wafer, which is disposed in a vertical orientation, between the plurality of gripping pins, wherein the first distance is greater than the second distance;
• and
• rotating the gripper assembly, the catch cup, and the vertically oriented wafer simultaneously about the central axis during a cleaning process.