Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsShota Umezaki, Hiroaki Inadomi
Life of this patent
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Abstract
A substrate processing apparatus is configured to dry a substrate by replacing a liquid film formed on a top surface of the substrate, which is horizontally held, with a supercritical fluid. The substrate processing apparatus includes a pressure vessel, a cover body and a supporting body. The pressure vessel has therein a drying chamber for the substrate. The cover body is configured to close an opening of the drying chamber. The supporting body is configured to support the substrate horizontally within the drying chamber. The supporting body is fixed to the drying chamber.
Claims16
A substrate processing apparatus configured to dry a substrate by replacing a liquid film formed on a top surface of the substrate, which is horizontally held, with a supercritical fluid, the substrate processing apparatus comprising:
- a pressure vessel having therein a drying chamber for the substrate;
- a cover body configured to close an opening of the drying chamber;
- and
- a supporting body configured to support the substrate horizontally within the drying chamber,
- wherein the supporting body is fixed to the drying chamber.
A substrate processing method, comprising:
- horizontally holding a substrate having a liquid film formed thereon with a transfer device, and advancing the transfer device into a drying chamber through an opening of the drying chamber;
- receiving, with a supporting body fixed to the drying chamber, the substrate from the transfer device, and supporting the received substrate horizontally;
- retreating the transfer device to an outside of the drying chamber through the opening thereof;
- closing the opening of the drying chamber with a cover body;
- and
- replacing the liquid film with a supercritical fluid in the drying chamber to dry the substrate.
Dependencies are inferred from the claim text.