Multi-patterned sputter traps and methods of making

A method of forming a particle trap on a sputtering chamber component, the method comprising:

• forming a first pattern on at least a portion of a surface of the sputtering chamber component to form a first patterned top surface;
• and,
• forming a second pattern on at least a portion of the first patterned top surface;
• wherein the first pattern comprises one of:
• a plurality of first indentations arranged in a repeating pattern with adjacent first indentations separated by side walls, the first indentations having a first depth and a first width, and
• a plurality of first ridges arranged in a repeating pattern with adjacent first ridges separated by grooves, the first ridges having a first height and a first width;
• and,
• wherein the second pattern comprises one of:
• a plurality of second indentations arranged in a repeating pattern with adjacent second indentations separated by side walls, the second indentations having a second depth and a second width, and
• a plurality of second ridges arranged in a repeating pattern with adjacent second ridges separated by grooves, the second ridges having a second height and a second width,
• wherein the first pattern is formed by pressing a first knurling tool having a first thread count into the sputtering chamber component and the second pattern is formed by pressing a second knurling tool having a second thread count into the sputtering chamber component, wherein the first thread count and the second thread count are different.