Multi-layer ceramic electronic component, multi-layer ceramic electronic component mounting substrate, multi-layer ceramic electronic component package, and method of producing a multi-layer ceramic electronic component

A method of producing a multi-layer ceramic electronic component, comprising:

• forming an internal electrode pattern having a predetermined thickness on an unsintered ceramic sheet;
• forming a dielectric pattern in an electrode non-formation region around the internal electrode pattern on the ceramic sheet such that the dielectric pattern occupies 75% or more and less than 100% of a space portion facing the electrode non-formation region and having the predetermined thickness;
• laminating in a first direction the ceramic sheets on each of which the internal electrode pattern and the dielectric pattern are formed, and thereby forming a ceramic body including a plurality of internal electrodes laminated in the first direction;
• and
• forming a pair of external electrodes that are connected to the plurality of internal electrodes and face each other in a second direction orthogonal to the first direction,
• a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first direction and the second direction.