Circuit substrate
AssigneeKoa Corporation
InventorSatoshi KANEGAE
Life of this patent
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Abstract
Particularly, it is an object to provide a circuit substrate that can reduce a field intensity near an electrode having a high potential. A circuit substrate of the present invention includes an insulated substrate, a thin-film resistive element, and electrodes electrically connected to both sides of the thin-film resistive element, the thin-film resistive element and the electrodes being disposed on a surface of the insulated substrate. The circuit substrate is characterized in that the thin-film resistive element has a pattern in which a resistance wire is repeatedly folded back, and a dummy wire for reducing a field intensity is provided on a high-potential electrode side.
Claims6
A circuit substrate comprising an insulated substrate, a thin-film resistive element, and electrodes electrically connected to both sides of the thin-film resistive element, the thin-film resistive element and the electrodes being disposed on a surface of the insulated substrate, characterized in that
- the thin-film resistive element has a pattern in which a resistance wire is repeatedly folded back, and
- a dummy wire for reducing a field intensity is provided on a high-potential electrode side.
Dependencies are inferred from the claim text.