Photo-etched chassis cooling walls
AssigneeHewlett Packard Enterprise Development LP
InventorsJohn Franz, Harvey Lunsman
Life of this patent
Estimating the term…
Abstract
An electronic component enclosure includes a plurality of wall structures defining outer walls of the enclosure. Each wall structure has an internal fluid channel for circulation of cooling fluid. The enclosure further includes at least one partition structure disposed within the outer walls and having an internal fluid channel in sealed fluid communication with the internal fluid channel of at least one of the plurality of wall structures. The internal fluid channel of at least one of the plurality of wall structures and the internal fluid channel of the at least one partition structure defines a continuous fluid circulation path between a fluid inflow port and a fluid outflow port.
Claims20
An electronic component enclosure comprising:
- a plurality of outer walls, each outer wall comprising a thermally conductive material and an internal fluid channel for circulation of cooling fluid;
- at least one partition structure comprising a thermally conductive material and an internal fluid channel in sealed fluid communication with the internal fluid channel of at least one outer wall of the plurality of outer walls;
- a fluid inflow port in sealed fluid communication with the internal fluid channel of the at least one outer wall of the plurality of outer walls;
- and
- a fluid outflow port in sealed fluid communication with the internal fluid channel of the at least one outer wall of the plurality of walls,
- wherein the internal fluid channels of the plurality of outer walls and the internal fluid channel of the at least one partition structure define a continuous fluid circulation path between the fluid inflow port and the fluid outflow port.
An enclosure system for electronic components, comprising:
- a substantially sealed heat-capturing enclosure, the enclosure comprising:
- a plurality of outer walls, each outer wall comprising a thermally conductive material and an internal fluid channel for circulation of cooling fluid;
- at least one partition structure defining at least one compartment within the plurality of outer walls, the at least one partition structure comprising a thermally conductive material and having an internal fluid channel in sealed fluid communication with the internal fluid channel of at least one outer wall of the plurality of outer walls;
- a fluid inflow port in sealed fluid communication with the internal fluid channel of the at least one outer wall of the plurality of outer walls;
- and
- a fluid outflow port in sealed fluid communication with the internal fluid channel of at least one outer wall of the plurality of outer walls, wherein the internal fluid channels of the plurality of outer walls and the internal fluid channel of the at least one partition structure define a continuous fluid circulation path between the fluid inflow port and the fluid outflow port;
- and
- a heat exchanger coupled to the fluid inflow port and the fluid outflow port of the enclosure, the heat exchanger to circulate cooling fluid through the continuous fluid circulation path.
A method of capturing heat from an electronic component, comprising:
- enclosing the electronic component in a substantially sealed enclosure including a plurality of outer walls and a partition structure defining at least one compartment within the enclosure;
- and
- circulating cooling fluid in a continuous loop through an internal fluid channel in each of the outer walls and an internal fluid channel in the partition structure, the fluid channel in the partition structure being in sealed fluid communication with the internal fluid channel of at least one outer wall of the plurality of outer walls.
Dependencies are inferred from the claim text.