Semiconductor laser device
AssigneeMitsubishi Electric Corporation
InventorsYuji IWAI, Motoharu MIYASHITA, Kyosuke KURAMOTO
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Abstract
A semiconductor laser device is configured so that, on at least one of the respective opposing surfaces of a semiconductor laser chip and a sub-mount and the respective opposing surfaces of the sub-mount and a heatsink, one or more treatment regions are provided where adhesion of a bonding material or bonding material used for their bonding is reduced, wherein the one or more treatment regions are placed to define, in a traveling direction of light, different coverages depending on a position in an array direction of multiple light emitting regions.
Claims19
A semiconductor laser device, comprising:
- a plate-like semiconductor laser chip in which multiple light emitting regions each extending along a traveling direction of light are arrayed in order in a direction perpendicular to the traveling direction, with an interval therebetween;
- a sub-mount which is bonded to the semiconductor laser chip;
- and
- a heatsink which is bonded to the sub-mount on its side opposite to its side where the sub-mount is bonded to the semiconductor laser chip;
- wherein, on at least one of respective opposing surfaces of the semiconductor laser chip and the sub-mount and respective opposing surfaces of the sub-mount and the heatsink, one or more treatment regions are provided where adhesion of a bonding material used for their bonding is reduced, said one or more treatment regions being placed to define, in the traveling direction, different coverages depending on a position in an array direction of the multiple light emitting regions.
-9. (canceled)
A semiconductor laser device, comprising:
- a plate-like semiconductor laser chip in which multiple light emitting regions each extending along a traveling direction of light are arrayed in order in a direction perpendicular to the traveling direction, with an interval therebetween;
- a sub-mount which is bonded to the semiconductor laser chip;
- and
- a heatsink which is bonded to the sub-mount on its side opposite to its side where the sub-mount is bonded to the semiconductor laser chip;
- wherein a thermal resistance in heat transfer paths that connect the respective multiple light emitting regions and the heatsink, monotonically decreases or mono-tonically increases as a position in an array direction of the multiple light emitting regions moves from one end side of that regions toward another end side thereof.
Dependencies are inferred from the claim text.