Interposer

An interposer held between a pair of electronic components and contacting a plurality of connection pads formed on each of the electronic components to electrically connect the electronic components, the interposer comprising:

• a housing having a first surface facing a first electronic component of the electronic components, a second surface facing a second electronic component of the electronic components, and a plurality of through-holes penetrating the first surface and the second surface;
• and
• a signal contact pair composed of a pair of signal contacts each including:
• a base portion press-fitted in one of the through-holes;
• a first contact beam extending from the base portion outward beyond the first surface obliquely in a thickness direction to the first surface and having at a distal end a first contact portion contacting the first electronic component;
• and
• a second contact beam extending from the base portion outward beyond the second surface obliquely in the thickness direction to the second surface and having at a distal end a second contact portion contacting the second electronic component, the pair of signal contacts are positioned adjacently to each other widthwise and are each asymmetrical with respect to a width direction, the signal contact pair has a plane-symmetrical shape with respect to the width direction.