Oled encapsulation structure, method of encapsulating the oled, and oled display device

A method of encapsulating an organic light-emitting diode (OLED), comprising the following steps:

• (1) providing a substrate on which an OLED device is fabricated;
• (2) forming an inorganic encapsulation layer on the substrate to cover the OLED device;
• (3) forming a self-healing encapsulation layer on the inorganic encapsulating layer in the step (2), wherein the self-healing encapsulation layer is made of a material comprising methyl methacrylate and n-butyl acrylate that are mixed in a preset molar ratio;
• (4) forming an inorganic encapsulation layer on the self-healing encapsulation layer in the step (3), wherein a cavity is formed between the inorganic encapsulation layer in the step (2) and the inorganic encapsulation layer in the step (4), and the self-healing encapsulation layer in the step (4) is wrapped in the cavity;
• and
• (5) performing the steps (3) and (4) cyclically until formations of all the inorganic encapsulation layers and the self-healing encapsulation layer have been completed.

An organic light-emitting diode (OLED) display device, comprising an OLED display panel which comprises an OLED encapsulation structure, wherein

• the OLED encapsulation structure comprises a substrate, a self-healing encapsulation layer, and at least two inorganic encapsulation layers,
• wherein a number of layers of the self-healing encapsulation layer is one less than a number of layers of the inorganic encapsulation layers, and the self-healing encapsulation layer is made of a material comprising methyl methacrylate and n-butyl acrylate that are mixed in a preset molar ratio;
• and
• wherein an OLED device is fabricated on the substrate, a cavity is formed between two adjacent layers of the inorganic encapsulation layers, a layer of the self-healing encapsulation layer is provided in the cavity, and one of the inorganic encapsulation layers covers the OLED device.