Micro light-emitting diode display fabrication and assembly
AssigneeIntel Corporation
InventorsKhaled AHMED, Anup PANCHOLI
Life of this patent
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Abstract
Micro light-emitting diode (LED) display fabrication and assembly are described. In an example, a micro-light emitting diode (LED) display panel includes a display backplane substrate having a plurality of metal bumps thereon. A plurality of LED pixel elements includes ones of LED pixel elements bonded to corresponding ones of the plurality of metal bumps of display backplane substrate. One or more of the plurality of LED pixel elements has a graphene layer thereon. The graphene layer is on a side of the one or more of the plurality of LED pixel elements opposite the side of the metal bumps.
Claims20
A micro-light emitting diode (LED) display panel, comprising:
- a display backplane substrate having a plurality of metal bumps thereon;
- a plurality of LED pixel elements comprising ones of LED pixel elements bonded to corresponding ones of the plurality of metal bumps of display backplane substrate, one or more of the plurality of LED pixel elements having a graphene layer thereon, the graphene layer on a side of the one or more of the plurality of LED pixel elements opposite the side of the metal bumps.
A microstructure, comprising:
- a metal bump;
- and
- an LED pixel element bonded to the metal bump, the LED pixel element having a graphene layer thereon, the graphene layer on a side of the LED pixel element opposite a side bonded to the metal bump.
An electronic device, comprising:
- a processor;
- and
- a display coupled to the processor, the display comprising:
- a display backplane substrate having a plurality of metal bumps thereon;
- a plurality of LED pixel elements comprising ones of LED pixel elements bonded to corresponding ones of the plurality of metal bumps of display backplane substrate, one or more of the plurality of LED pixel elements having a graphene layer thereon, the graphene layer on a side of the one or more of the plurality of LED pixel elements opposite the side of the metal bumps.
An electronic device, comprising:
- a processor;
- and
- a microstructure coupled to the processor, the microstructure comprising:
- a metal bump;
- and
- an LED pixel element bonded to the metal bump, the LED pixel element having a graphene layer thereon, the graphene layer on a side of the LED pixel element opposite a side bonded to the metal bump.
Dependencies are inferred from the claim text.