Process for producing a semiconductor component based on a iii-n compound

Abstract

The present description concerns a method of manufacturing a semiconductor component (170), including the successive steps of: providing a stack including a first semiconductor layer (105) made of a III-N compound and a second conductive layer (107) coating the first layer; forming a trench (110) crossing the second layer (107) and stopping on the first layer (105), said trench laterally delimiting a contact metallization in the second layer (107); forming in said trench (110) a metal spacer (111) made of a material different from that of the second layer (107), in contact with the sides of the contact metallization; and continuing said trench (110) through at least a portion of the thickness of the first layer (105).

Dependencies are inferred from the claim text.