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US 2022/0037496 A1Published application
Multigate device with air gap spacer and backside rail contact and method of fabricating thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsGuan-Lin CHEN, Kuo-Cheng CHIANG, Shi Ning JU, Chih-Hao WANG, Kuan-Lun CHENG
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