Silicon carbide semiconductor device and method of manufacturing same
AssigneeMitsubishi Electric Corporation
InventorsRina TANAKA, Katsutoshi SUGAWARA, Yutaka FUKUI, Hideyuki HATTA, Yusuke MIYATA
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AssigneeMitsubishi Electric Corporation
InventorsRina TANAKA, Katsutoshi SUGAWARA, Yutaka FUKUI, Hideyuki HATTA, Yusuke MIYATA
Estimating the term…
A drift layer is made of silicon carbide and has a first conductivity type. At least one trench has a first side surface facing a Schottky barrier diode region, and a second side surface extending in a transistor region and contacting a source region, a body region, and the drift layer. A first protective region is provided under the at least one trench, has a second conductivity type, and is higher in impurity concentration of the second conductivity type than the body region. A second protective region extends from the first protective region, reaches at least one of the first side surface and an end region of the second side surface continuous with the first side surface, has an uppermost portion shallower than a lowermost portion of the body region, and is higher in impurity concentration of the second conductivity type than the body region.
A silicon carbide semiconductor device with a transistor region in which a Schottky barrier diode region is interposed in at least one direction included in an in-plane direction, the silicon carbide semiconductor device comprising:
A method of manufacturing a silicon carbide semiconductor device with a transistor region in which a Schottky barrier diode region is interposed in at least one direction included in an in-plane direction, the method comprising:
Dependencies are inferred from the claim text.