Backside-illumination solid-state image pickup apparatus and backside-illumination solid-state image-pickup-apparatus manufacturing method, image pickup apparatus, and electronic equipment

An image pickup apparatus comprising:

• a backside-illumination solid-state image pickup apparatus including
• a first semiconductor element having an image pickup element that generates a pixel signal of each pixel,
• a second semiconductor element and a third semiconductor element that are smaller than the first semiconductor element, the second semiconductor element and the third semiconductor element having signal processing circuits that are embedded therein by using embedment members and that are necessary for signal processing of the pixel signal, and
• a communication wire that electrically connects the second semiconductor element and the third semiconductor element.

Electronic equipment comprising:

• a backside-illumination solid-state image pickup apparatus including
• a first semiconductor element having an image pickup element that generates a pixel signal of each pixel,
• a second semiconductor element and a third semiconductor element that are smaller than the first semiconductor element, the second semiconductor element and the third semiconductor element having signal processing circuits that are embedded therein by using embedment members and that are necessary for signal processing of the pixel signal, and
• a communication wire that electrically connects the second semiconductor element and the third semiconductor element.

A method of manufacturing a backside-illumination solid-state image pickup apparatus, the backside-illumination solid-state image pickup apparatus including

• a first semiconductor element having an image pickup element that generates a pixel signal of each pixel,
• a second semiconductor element and a third semiconductor element that are smaller than the first semiconductor element, the second semiconductor element and the third semiconductor element having signal processing circuits that are embedded therein by using embedment members and that are necessary for signal processing of the pixel signal, and
• a communication wire that electrically connects the second semiconductor element and the third semiconductor element, wherein
• the second semiconductor element and the third semiconductor element with the signal processing circuits that are included in the second semiconductor element and the third semiconductor element formed by a semiconductor process, the second semiconductor element and the third semiconductor element being determined as good elements by an electrical inspection, are re-arranged on a wafer having the image pickup element formed by a semiconductor process and embedded by using the embedment members,
• a communication wire that electrically connects the second semiconductor element and the third semiconductor element is formed, and
• the first semiconductor element, the second semiconductor element, and the third semiconductor element are stacked by oxide-film joining such that wires are electrically connected between the first semiconductor element, and the second semiconductor element and the third semiconductor element, and then are diced.

A backside-illumination solid-state image pickup apparatus comprising:

• a first semiconductor element layer having an image pickup element that generates a pixel signal of each pixel;
• a second semiconductor element layer having a second semiconductor element and a third semiconductor element that are smaller than the first semiconductor element, the second semiconductor element and the third semiconductor element having signal processing circuits that are embedded therein by using embedment members and that are necessary for signal processing of the pixel signal;
• and
• a support board, wherein
• the second semiconductor element layer is provided between the first semiconductor element layer and the support board, and
• the first semiconductor element layer and the second semiconductor element layer are joined by direct joining.