US 2022/0037333 A1 · METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR STRUCTURE

Abstract

Embodiments relate to a method for manufacturing a semiconductor structure, and the semiconductor structure. The method includes: providing a substrate in which a plurality of contact pads arranged in an array are provided, wherein the contact pad protrudes from the upper surface of the substrate; forming a first barrier layer on the substrate and the surface of the contact pad; forming a first conductive layer on the surface of the first barrier layer; etching the upper surface of the first conductive layer to form a first recessed structure and a second recessed structure, wherein the first recessed structure extends downward to the substrate, the projection of the first recessed structure on the substrate surrounds the contact pad, and the second recessed structure is formed in the first conductive layer and arranged above each of the corresponding contact pads.

Claims16

Dependent claims

A method for manufacturing a semiconductor structure, comprising the following steps:

providing a substrate, wherein a plurality of contact pads arranged in an array are provided in the substrate, and the plurality of contact pads protrude from an upper surface of the substrate;
forming a first barrier layer on the substrate and surfaces of the plurality of contact pads;
forming a first conductive layer on a surface of the first barrier layer;
etching an upper surface of the first conductive layer to form a first recessed structure and a second recessed structure, wherein the first recessed structure extends downwards to the substrate, the projection of the first recessed structure on the substrate surrounds a given one of the plurality of contact pads, and the second recessed structure is formed in the first conductive layer and arranged above the corresponding contact pad;
and
forming a first dielectric layer, a second barrier layer, and a second conductive layer sequentially on surfaces of the first conductive layer.

3 more elements

A semiconductor structure, comprising:

a substrate, wherein a plurality of contact pads arranged in an array are provided in the substrate, and the plurality of contact pads protrude from an upper surface of the substrate;
a first barrier layer, arranged on the substrate and surfaces of the plurality of contact pads;
a first conductive layer, arranged on the surface of the first barrier layer;
a first recessed structure and a second recessed structure, wherein the first recessed structure extends downwards from an upper surface of the first conductive layer to the substrate, the projection of the first recessed structure on the substrate surrounds a given one of the plurality of contact pads, and the second recessed structure is formed in the first conductive layer and arranged above the contact pad;
and
a first dielectric layer, a second barrier layer, and a second conductive layer sequentially arranged above the first conductive layer.

3 more elements

Dependencies are inferred from the claim text.

Method for manufacturing semiconductor structure, and semiconductor structure

Life of this patent

Method for manufacturing semiconductor structure, and semiconductor structure

Life of this patent

Abstract

Claims16