Back to results
US 2022/0037291 A1Published application
Die stack with cascade and vertical connections
AssigneeIntel Corporation
InventorsMin-Tih Ted Lai, Florence R. Pon, Yuhong Cai, John G. Meyers
Life of this patent
Estimating the term…
Abstract
An electronic assembly includes a plurality of electronic die arranged into shingles, each shingle having a multiple offset stacked die coupled by cascading connections. Each shingle is arranged in a stack of shingles with alternate shingles having die stacked in opposite directions and offset in a zigzag manner to facilitate vertical electrical connections from a top of the electronic assembly to a bottom die of each shingle.
Claims17
An electronic assembly, comprising:
- a first shingle having multiple stacked offset die coupled via wirebonds on a top side and a first end of the first shingle;
- a second shingle stacked on the first shingle having multiple stacked offset die coupled via wirebonds on a top side and a first end of the second shingle opposite the first end of the first shingle;
- an electrical redistribution layer over the top side of the second shingle;
- and
- multiple conductive vertical connections directly coupled between the redistribution layer and only one die in each of the first and second shingles.
2 more elements
An electronic assembly comprising:
- a plurality of electronic die arranged into shingles, each shingle having a multiple offset stacked die coupled by cascading connections;
- and
- a plurality of direct conductive vertical connections only between the bottom die of each shingle to a top surface of an overmold of the electronic assembly.
An electronic assembly comprising:
- a plurality of electronic die arranged into shingles, each shingle having a multiple offset stacked die coupled by cascading connections, the shingles arranged in a stack of shingles;
- a plurality of direct conductive vertical connections only between the bottom die of each shingle to a top surface of an overmold of the electronic assembly;
- wherein a shingle offset between shingles decreases with increasing height of the stack of shingles.
Dependencies are inferred from the claim text.