Semiconductor Device and Method of Manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHaohua Zhou, Mei Hsu Wong, Tze-Chiang Huang
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Abstract
A plurality of semiconductor devices are arranged in a stack. Individual semiconductor devices within the stack are selected by an identity signal sent into the stack. The signal is compared within each stack to a unique stack identifier stored within each of the semiconductor devices and, when the signal is the same as the unique stack identifier, the semiconductor device is selected while, when the signal is not the same as the unique stack identifier, the semiconductor device remains within the default bypass mode.
Claims20
A semiconductor device comprising:
- a first semiconductor device comprising:
- a first unique identifier structure;
- a first electrical input;
- and
- a first comparator comprising a first input connected to the first unique identifier structure and comprising a second input connected to the first electrical input;
- a second semiconductor device bonded to the first semiconductor device, the second semiconductor device comprising:
- a second unique identifier structure different from the first unique identifier structure;
- a second electrical input electrically connected to the first electrical input;
- and
- a second comparator comprising a third input connected to the second unique identifier structure and comprising a fourth input connected to the second electrical input.
A semiconductor device comprising:
- a first semiconductor die comprising:
- a first input region;
- a first output region;
- a first inout region;
- a first identifier region;
- and
- a first external connection electrically connected to a first comparator, the first comparator also being electrically connected to the first identifier region, an output of the first comparator being connected to both the first output region and the first inout region;
- and
- a second semiconductor die bonded to the first semiconductor die, the second semiconductor die comprising:
- a second input region;
- a second output region;
- a second inout region;
- a second identifier region, the second identifier region having a different structure than the first identifier region;
- and
- a second comparator electrically connected to the first external connection by a through via, wherein an output of the second comparator is connected to both the second output region and the second inout region.
A method of sending and receiving data, the method comprising:
- sending a stack identifier signal into both a first semiconductor device and a second semiconductor device, wherein the first semiconductor device and the second semiconductor device are bonded to each other;
- within the first semiconductor device, comparing the stack identifier signal to a first unique identifier, wherein when the stack identifier signal is the same as the first unique identifier a first select signal is generated;
- and
- within the second semiconductor device, comparing the stack identifier signal to a second unique identifier, the second unique identifier being different from the first unique identifier, wherein when the stack identifier signal is the same as the second unique identifier a second select signal is generated, the second select signal being different from the first select signal.
Dependencies are inferred from the claim text.