Process for electrically connecting contact surfaces of electronic components

A process for electrically connecting a contact surface of a first electronic component with a contact surface of a second electronic component comprising the subsequent steps:

• (1) capillary wedge bonding a wire having a circular cross-section with an average diameter in the range of 8 to 80 μm to the contact surface of the first electronic component,
• (2) raising the capillary wedge bonded wire to form a wire loop between the capillary wedge bond formed in step (1) and the contact surface of the second electronic component, and
• (3) stitch bonding the wire to the contact surface of the second electronic component,
• wherein the capillary wedge bonding of step (1) is carried out with a ceramic capillary having a lower face angle within the range of from zero to 4 degrees,
• wherein the wire comprises a wire core with a surface, the wire core having a double-layered coating superimposed on its surface,
• wherein the wire core consists of a material selected from the group consisting of pure silver, doped silver with a silver content of >99.5 wt.-% and silver alloys with a silver content of at least 89 wt.-%, and
• wherein the double-layered coating comprises a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.