Techniques for forming semiconductor device packages and related packages, intermediate products, and methods

A semiconductor device package, comprising:

• a first semiconductor device over a substrate;
• a second semiconductor device over the first semiconductor device, an active surface of the second semiconductor device facing away from the substrate;
• at least one conductor extending from a bond pad of the second semiconductor device, along surfaces of the second semiconductor device, first semiconductor device, and substrate to a conductive pad of the substrate, the at least one conductor in contact with the bond pad and the conductive pad and a dielectric material interposed between the at least one conductor and the first semiconductor device and between the at least one conductor and the second semiconductor device, a lateral side surface of the first semiconductor device intersecting the conductive pad;
• and
• an encapsulant distinct from the dielectric material extending over the at least one conductor and exposed surfaces of the first semiconductor device, the second semiconductor device, and an upper surface of the substrate.