Packaged circuit structure and method for manufacturing the same

A method for manufacturing a package circuit structure comprising:

• providing a metal board along a thickness direction comprising a first surface and a second surface facing away from the first surface;
• recessing at least one first groove from the first surface toward the second surface, recessing at least one second groove from the second surface toward the first surface, wherein each of the at least one first groove and each of the at least one second groove are spaced with each other along a first direction perpendicular to the thickness direction;
• mounting an embedded component in each of the at least one first groove and each of the at least one second groove respectively;
• laminating a dielectric layer and an antenna circuit board sequentially on each of the first surface and the second surface of the metal board with the embedded components respectively, wherein two dielectric layers cover the first surface and the second surface, and fill the at least one first groove and the at least one second groove, two antenna circuit boards are stacked on opposite sides of the two dielectric layers along the thickness direction facing away from each other, each of the two antenna circuit boards comprises at least one antenna and at least one ground wiring, the metal board is electrically connected to the at least one ground wiring.