Semiconductor device for power electronics applications
OwnerRalf LERNER, Nis Hauke HANSENinventors
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OwnerRalf LERNER, Nis Hauke HANSENinventors
Estimating the term…
The present invention suggests a semiconductor device for integration into a power module. The semiconductor device comprises (a) a semiconductor layer (10), a first side of the semiconductor layer (10) having a plurality of depressions (11); (b) an insulating layer (12; 12a, 12b), the insulating layer being deposited on the first side of the semiconductor layer (10) and engaging in the depressions (11); (c) a first electrically conductive layer (14; 14a, 14b) for contacting the semiconductor device (1, 2), the first electrically conductive layer (14; 14a, 14b) being deposited on the insulating layer (12a, 12b); and (d) a second electrically conductive layer (16) for contacting the semiconductor device (1, 2), the second electrically conductive layer (16) being deposited on a second side of the semiconductor layer (10) opposite to the first side. The first electrically conductive layer (14; 14a, 14b) has a plurality of recesses (20, 20) and a plurality of subregions (24), and each subregion (24) is enclosed by at least one recess (20), leaving at least one region (22, 22) having a narrowed cross-section.
A semiconductor device for integration into a power module, the semiconductor device comprising
A semiconductor device for integration into a power module, the semiconductor device comprising
A semiconductor device for integration into a power module with at least one deactivatable power semiconductor, the semiconductor device comprising
A method of operating a power module including a multi-layer semiconductor device,
Dependencies are inferred from the claim text.