Package structure and manufacturing method thereof

A package structure, comprising:

• a redistribution circuit structure;
• a wiring substrate disposed on the redistribution circuit structure, wherein the wiring substrate has beveled edges;
• a semiconductor device disposed on the redistribution circuit structure opposite to the wiring substrate;
• and
• an insulating encapsulation laterally encapsulating the wiring substrate.

A manufacturing method of a package structure, comprising:

• providing a carrier;
• forming a redistribution circuit structure having a first surface and a second surface opposite to the first surface;
• forming a reinforcement structure over the carrier;
• mounting a wiring substrate on the first surface of the redistribution circuit structure, wherein a sidewall of the wiring substrate is overlapped with the reinforcement structure along a direction perpendicular to the first surface of the redistribution circuit structure;
• encapsulating the wiring substrate and the reinforcement structure by an insulating encapsulation;
• de-bonding the redistribution circuit structure from the carrier;
• and
• mounting a semiconductor device on the second surface of the redistribution circuit structure.