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US 2022/0037265 A1Published application
Semiconductor packages including at least one die position checker
AssigneeSK hynix Inc.
InventorsBok Gyu MIN, Suk Won LEE
Life of this patent
Estimating the term…
Abstract
A semiconductor package may include a first die disposed on a package substrate, a second die stacked on the first die, and a first position checker disposed on the package substrate. The first position checker may indicate a first position allowable range in which a first side of the first die can be located.
Claims24
A semiconductor package comprising:
- a first die disposed on a package substrate;
- a second die stacked on the first die;
- and
- first and second position checkers disposed on the package substrate,
- wherein the first position checker indicates a first position allowable range in which a first side of the first die can be located, and
- wherein the second position checker indicates a second position allowable range in which a second side of the second die can be located.
3 more elements
A semiconductor package comprising:
- a first die disposed on a package substrate;
- a second die stacked on the first die;
- a third die stacked on the second die;
- and
- first, second, and third position checkers disposed on the package substrate,
- wherein in order to indicate a first position allowable range in which a first side of the first die can be located, the first position checker comprises:
- a first reference pattern indicating a first reference position where the first side of the first die is to be located;
- and
- a first limit pattern spaced apart from the first reference pattern by the first position allowable range, and
- wherein in order to indicate a second position allowable range in which a second side of the second die can be located, the second position checker comprises:
- a second reference pattern indicating a second reference position where the second side of the second die is to be located;
- and
- a second upper limit pattern and a second lower limit pattern that are spaced apart from each other with the second reference pattern therebetween.
10 more elements
A semiconductor package comprising:
- a first die disposed on a package substrate;
- a second die stacked on the first die to be offset in a Y-axis direction;
- and
- first and second position checkers disposed on the package substrate,
- wherein the first and second position checkers are disposed to be spaced apart from the first and second dies in an X-axis direction, and
- wherein the second position checker is disposed to be spaced apart from the first position checker in the Y-axis direction.
3 more elements
A semiconductor package comprising;
- a first die disposed on a package substrate;
- a second die stacked on the first die and offset stacked by a distance from the first die;
- and
- a first position checker disposed on the package substrate and spaced apart from the first die,
- wherein the first position checker indicates a first position allowable range in which a first side of the first die can be located to have a normal separation distance from a second side of the second die.
2 more elements
Dependencies are inferred from the claim text.