Carrier, assembly with a carrier, and method for producing a carrier

A method for producing a carrier comprising:

• providing a main body of a material comprising a thermal conductivity of at least 380 W/(m K), wherein the main body comprises a mounting surface for mechanical and thermal connection with a component,
• introducing a recess in the main body completely along a first direction perpendicular to the main extension plane of the main body,
• introducing an electrically insulating filler into the recess,
• introducing a further recess) in the filler completely along the first direction,
• coating an inner wall of the filler surrounding the further recess) with an electrically conductive coating, and thereby
• forming a via through the main body, wherein providing the main body comprises:
• forming the mounting surface of the main body on a protruding region of the main body along the first direction,
• arranging electrically insulating material laterally to the side of the protruding region,
• forming a contact pad on a side of the electrically insulating material facing away from the main body, electrically connected with the coating and wherein
• an inner space laterally delimited by the coating comprises a further filler, which is planarized with copper.