Semiconductor device and method for manufacturing semiconductor device

A method for manufacturing a semiconductor device, the semiconductor device comprising:

• a semiconductor element having an element obverse face and an element reverse face that face toward mutually opposite sides in a first direction;
• a first conductor and a second conductor arranged spaced apart from each other, and
• a connecting member having a connecting member obverse face facing toward one side in the first direction and including a first protrusion protruding in the first direction from the connecting member obverse face,
• the method comprising:
• a connecting member preparation step of preparing the connecting member;
• a mounting step of mounting the semiconductor element to the first conductor;
• a sintering metallic material forming step of forming a sintering metallic material on the element obverse face;
• a connecting step of placing a portion of the connecting member on the sintering metallic material such that the connecting member obverse face is in an orientation facing in a same direction as the element obverse face and such that the sintering metallic material and the first protrusion overlap with each other as viewed in the first direction;
• and
• a pressure heating step of pressing, using a pressing member, the connecting member from a side on which the first protrusion is formed, and heating the sintering metallic material into a sintered metal.