Back to results
US 2022/0037246 A1Published application
Package including a substrate with high resolution rectangular cross-section interconnects
AssigneeQUALCOMM Incorporated
InventorSebastian BRUNNER
Life of this patent
Estimating the term…
Abstract
A package that includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer coupled to the substrate. The encapsulation layer encapsulates the integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, wherein at least one of the interconnects has a rectangular side cross-section having at least one corner with a corner radius less than a corner radius threshold.
Claims26
A package comprising:
- an integrated device;
- and
- a substrate coupled to the integrated device, the substrate comprising:
- at least one dielectric layer;
- and
- a plurality of interconnects located in the at least one dielectric layer, wherein at least one interconnect has a cross-sectional thickness that varies along a length of the interconnect by no more than 3 micrometers.
3 more elements
A substrate comprising:
- at least one dielectric layer;
- and
- a plurality of interconnects located in the at least one dielectric layer, wherein at least one interconnect has a surface roughness that is in a range of approximately 1-3 micrometers.
A method for fabricating a substrate, the method comprising:
- forming at least one dielectric layer;
- and
- forming a plurality of interconnects in or over the at least one dielectric layer, wherein at least one interconnect has a surface roughness that is in a range of approximately 1-3 micrometers.
Dependencies are inferred from the claim text.