US 2022/0037245 A1 · INTEGRATED SUBSTRATE STRUCTURE, ELECTRONIC ASSEMBLY, AND MANUFACTURING METHOD THEREOF

Abstract

An integrated substrate, an electronic assembly, and manufacturing methods thereof are provided. The integrated substrate structure includes a coarse redistribution structure, fine redistribution segments, and conductive connectors. The coarse redistribution structure includes a coarse dielectric layer and a coarse circuitry embedded therein. The fine redistribution segments disposed over the coarse redistribution structure and disposed side by side and apart from one another. The respective fine redistribution segment includes a fine dielectric layer thinner than the coarse dielectric layer, and a fine circuitry embedded in the fine dielectric layer. The fine circuitry includes a dimension and a pitch finer than those of the coarse circuitry, and a layout density of the fine circuitry is denser than that of the coarse circuitry. The conductive connectors are interposed between the coarse redistribution structure and the fine redistribution segments, and the coarse circuitry is electrically coupled to the fine circuitry through the conductive connectors.

Claims20

Dependent claims

An integrated substrate structure for coupling a fine-pitched chip, comprising:

a coarse redistribution structure comprising a coarse dielectric layer and a coarse circuitry embedded in the coarse dielectric layer;
a plurality of fine redistribution segments disposed over the coarse redistribution structure and coupled to the fine-pitched chip, the plurality of fine redistribution segments being disposed side by side and spatially apart from one another, each of the plurality of fine redistribution segments comprising:
a fine dielectric layer being thinner than the coarse dielectric layer;
and
a fine circuitry embedded in the fine dielectric layer, the fine circuitry comprising a dimension and a pitch finer than those of the coarse circuitry of the coarse redistribution structure, and a layout density of the fine circuitry being denser than a layout density of the coarse circuitry;
and
a plurality of conductive connectors interposed between the coarse redistribution structure and the plurality of fine redistribution segments, and the coarse circuitry being electrically coupled to the fine circuitry through the plurality of conductive connectors.

4 more elements

A manufacturing method of an integrated substrate structure, comprising:

forming a fine redistribution structure over a temporary carrier;
forming a plurality of first trenches in the fine redistribution structure to form a plurality of fine redistribution segments;
coupling a coarse redistribution structure to the plurality of fine redistribution segments through a plurality of conductive connectors, wherein a size of the coarse redistribution structure is greater than a size of the plurality of fine redistribution segments;
and
removing the temporary carrier from the plurality of fine redistribution segments after the coupling.

2 more elements

Dependencies are inferred from the claim text.

Integrated substrate structure, electronic assembly, and manufacturing method thereof

Life of this patent

Integrated substrate structure, electronic assembly, and manufacturing method thereof

Life of this patent

Abstract

Claims20