Integrated power switching device heat sink

A method for fabricating a semiconductor package that includes a plurality of leads, the method comprising:

• providing a heat sink that is formed of an electrically and thermally conductive material, the heat sink having a base, a mount, and a plurality of fins, wherein the mount extends from a first side of the base, wherein the plurality of fins are fixedly coupled to the base and extend from a second side of the base that is opposite the first side of the base, and wherein a first one of the plurality of leads is integrally and unitarily formed with the mount;
• attaching a semiconductor die that includes a power semiconductor device to the mount of the heat sink, the power semiconductor device having a plurality of terminals;
• coupling each of the leads that is not unitarily and integrally formed with the mount to its associated one of the terminals via a bond wire;
• and
• encapsulating the semiconductor die and the mount with a case formed of a first electrically insulating material.