Electronic package device and carrier structure thereof

An electronic package device, comprising:

• a carrier structure including:
• a die attach paddle;
• a ground frame surrounding the die attach paddle;
• a pin assembly including a plurality of pins that are spaced apart from one another, wherein the pins extend radially outward and are arranged to surround the ground frame;
• and
• a ground wing portion connected to the ground frame and located in a space under the pin assembly, wherein the ground wing portion includes an extending part and a joint part, the extending part extends away from the die attach paddle, and a top end of the extending part is located at a position above where a bottom surface of the die attach paddle is located;
• a chip disposed on the die attach paddle of the carrier structure;
• a plurality of first conductive wires connected to the chip and the ground frame;
• a plurality of second conductive wires connected to the chip and respectively connected to the pins;
• and
• a mold layer covering the chip, the first conductive wires, and the second conductive wires, wherein the mold layer partially covers the carrier structure, and the joint part of the ground wing portion is not covered by and exposed from the mold layer.