Semiconductor Package and Method for Fabricating a Semiconductor Package

A method for fabricating a semiconductor package, the method comprising:

• providing a semiconductor die;
• encapsulating the semiconductor die in an encapsulation, the encapsulation comprising a first side and an opposing second side;
• arranging a plurality of contact pads for electrically contacting the semiconductor die on the first side of the encapsulation;
• and
• arranging a plurality of inspection holes in the encapsulation in communication with the contact pads, the inspection holes extending from the first side to the second side, such that solder joints on the first side of the encapsulation are optically inspectable using the inspection holes viewed from the second side of the encapsulation.