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US 2022/0037220 A1Published application
Wiring substrate, electronic device, and electronic module
AssigneeKYOCERA Corporation
InventorsKyohei YAMASHITA, Yoshihiro HOSOI
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Abstract
A wiring substrate includes an insulating substrate, a conductor layer and an interlayer. The insulating substrate contains AlN. The conductor layer contains Cu. The interlayer is located between the insulating substrate and the conductor layer. In the interlayer, between a first region near the insulating substrate and a second region near the conductor layer, Cu concentration is higher in the second region than in the first region, and Al concentration is higher in the first region than in the second region.
Claims13
A wiring substrate comprising:
- an insulating substrate containing AlN;
- a conductor layer containing Cu;
- and
- an interlayer located between the insulating substrate and the conductor layer,
- wherein in the interlayer, between a first region near the insulating substrate and a second region near the conductor layer,
- Cu concentration is higher in the second region than in the first region, and
- Al concentration is higher in the first region than in the second region.
4 more elements
Dependencies are inferred from the claim text.