Hermetic semiconductor packages
AssigneeUTAC Headquarters Pte. Ltd.
InventorsEakkasit DUMSONG, Mike Jayson CANDELARIO, Phongsak Sawasdee, Jiraphat Charoenratpratoom, Paweena PHATTO, Maythichai SAITHONG
Life of this patent
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Abstract
A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.
Claims20
A method for forming a device comprising:
- providing a package substrate having a top substrate surface and a bottom substrate surface, the package substrate comprises
- a bottom cavity having a bottom cavity bottom surface and bottom cavity sidewalls,
- a top cavity disposed over the bottom cavity, the top cavity having a top cavity bottom surface at a top of the bottom cavity and top cavity sidewalls,
- a package bonding region, the package bonding region is a part of the top cavity, the package bonding region includes a first sealing region and a second sealing region,
- a first sealing ring bonded to the first sealing region, and
- a second sealing ring bonded to the second sealing region;
- bonding a die to a die attach region on the bottom cavity bottom surface;
- bonding a cap with a cap bonding region having a first cap sealing region and a second cap sealing region, wherein the first and second sealing rings are bonded to the first and second cap sealing regions of the cap bonding region to hermetically seal the die in the bottom and top cavities.
A hermetic package comprising:
- a package substrate having a top substrate surface and a bottom substrate surface, the package substrate comprises
- a bottom cavity having a bottom cavity bottom surface and bottom cavity sidewalls,
- a top cavity disposed over the bottom cavity, the top cavity having a top cavity bottom surface at a top of the bottom cavity and top cavity sidewalls,
- a package bonding region, the package bonding region is a part of the top cavity, the package bonding region includes a first sealing region and a second sealing region,
- a first sealing ring bonded to the first sealing region, and
- a second sealing ring bonded to the second sealing region;
- a die attached to a die attach region on the bottom cavity bottom surface;
- a cap with a cap bonding region having a first cap sealing region and a second cap sealing region, the first and second sealing rings are bonded to the first and second cap sealing regions of the cap bonding region to create a hermetically sealed cavity for the die.
A package substrate of a package comprising a substrate body having a top substrate surface and a bottom substrate surface, the substrate body comprises:
- a bottom cavity having a bottom cavity bottom surface and bottom cavity sidewalls;
- a top cavity disposed over the bottom cavity, the top cavity having a top cavity bottom surface at a top of the bottom cavity and top cavity sidewalls;
- and
- a package bonding region, the package bonding region is a part of the top cavity, the package bonding region includes a first sealing region and a second sealing region, wherein
- a first sealing ring bonded to the first sealing region,
- a second sealing ring bonded to the second sealing region, wherein the first and second sealing rings are configured to bond a cap to the package substrate to create a hermetically sealed cavity for a die disposed in the bottom cavity.
Dependencies are inferred from the claim text.