Method for producing semiconductor device, semiconductor package, and method for producing semiconductor package

A method for producing a semiconductor device, the method comprising:

• dicing, at a scribe area, a semiconductor wafer into a plurality of semiconductor chips each including at least one of a plurality of circuit areas, the semiconductor wafer including the plurality of circuit areas and the scribe area provided between neighboring circuit areas of the plurality of circuit areas, the scribe area extending in a first direction in a plan view,
• wherein the scribe area includes:
• a first area extending in the first direction;
• and
• second areas located on both sides of the first area in a second direction perpendicular to the first direction in the plan view, the second areas extending in the first direction, monitor pads being provided in the second areas,
• wherein the method comprises:
• before the dicing of the semiconductor wafer into the plurality of semiconductor chips, removing at least portions of the monitor pads by emitting laser beam to the second areas, and
• wherein, in the dicing of the semiconductor wafer into the plurality of semiconductor chips, the semiconductor wafer is diced at the first area.