Methods and apparatus for forming stabilization layers

A method of forming a capping layer on copper-based material, comprising:

• depositing a first capping layer on the copper-based material, wherein the first capping layer forms a continuous film on the copper-based material and wherein the first capping layer is formed of a first material that does not alloy with copper;
• depositing a second capping layer on the first capping layer, wherein the second capping layer is formed from a second material that alloys with copper;
• and
• wherein the first capping layer is configured to inhibit formation of voids in the copper-based material during subsequent high thermal budget processing.

A non-transitory, computer readable medium having instructions stored thereon that, when executed, cause a method for forming a stabilization layer on copper-based material to be performed, the method comprising:

• depositing a first stabilization layer on the copper-based material, wherein the first stabilization layer forms a continuous film on the copper-based material and wherein the first stabilization layer is formed of a first material that does not alloy with copper;
• depositing a second stabilization layer on the first stabilization layer, wherein the second stabilization layer is formed from a second material that alloys with copper;
• and
• wherein the first stabilization layer is configured to inhibit formation of voids in the copper-based material during subsequent high thermal budget processing.