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US 2022/0037166 A1Published application
Semiconductor package and method of fabricating the same
AssigneeChipbond Technology Corporation
InventorsChih-Ming Kuo, Lung-Hua Ho, You-Ming Hsu, Fei-Jain Wu
Life of this patent
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Abstract
A method of fabricating a semiconductor package includes the steps of: disposing semiconductor devices on a carrier; forming an encapsulation on the carrier to cover the semiconductor devices, a recession of the encapsulation includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion; and removing the strengthening portion of the recession of the encapsulation.
Claims18
A method of fabricating semiconductor package comprising steps of:
- disposing a plurality of semiconductor devices on a carrier;
- forming an encapsulation on the carrier, the encapsulation is configured to cover the plurality of semiconductor devices and includes a recession, wherein the recession includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion;
- and
- removing the strengthening portion of the recession of the encapsulation.
1 more element
A semiconductor package comprising:
- a carrier;
- a plurality of semiconductor devices disposed on the carrier;
- and
- an encapsulation disposed on the carrier and configured to cover the plurality of semiconductor devices, the encapsulation includes a recession, wherein the recession includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion.
1 more element
Dependencies are inferred from the claim text.