Deposition System With Multi-Cathode And Method Of Manufacture Thereof

A chamber comprising:

• a plurality of cathodes, each of the plurality of cathodes having a length and a volume a target below each of the plurality of cathodes, the target comprising material to be deposited on a carrier in a sputtering process;
• a rotating shield below the plurality of the cathodes configured to expose one of the plurality of the cathodes through a shroud below the one of the plurality of the cathodes and through a shield hole of the rotating shield, the shield hole below the shroud, the shroud having a length that is greater than the length of the one of the plurality of the cathodes and the shroud having a volume that is greater than the volume of the one of the plurality of cathodes;
• and
• a rotating pedestal configured to support the carrier.