Method of cleaning plasma processing apparatus and plasma processing apparatus

A plasma processing apparatus, comprising:

• a chamber;
• a stage provided inside the chamber and configured to mount a first dummy substrate or a second dummy substrate on the stage;
• a dry cleaning part configured to dry-clean an interior of the chamber;
• and
• a controller configured to control the dry cleaning part,
• wherein the controller controls the dry cleaning part so as to perform:
• disposing the first dummy substrate at a first position with respect to the stage inside the chamber and performing a first dry cleaning process inside the chamber;
• and disposing the second dummy substrate at a second position with respect to the stage inside the chamber and performing a second dry cleaning process inside the chamber,
• wherein each of a center of the first position and a center of the second position is located at a different position from a center of the stage in a plan view, and
• wherein the first position and the second position are different from each other in a plan view.

A method of cleaning a plasma processing apparatus, the method comprising:

• mounting a product substrate at a processing position with respect to a stage inside a chamber and performing plasma processing on the product substrate;
• and
• disposing a dummy substrate having a diameter smaller than a diameter of the product substrate at a cleaning position with respect to the stage inside chamber and performing a dry cleaning process inside the chamber,
• wherein each of a center of the processing position and a center of the cleaning position is located at the same position as a center of the stage in a plan view.