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US 2022/0037131 A1Published application
Stage and plasma processing apparatus
AssigneeTokyo Electron Limited
InventorRyota SAKANE
Life of this patent
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Abstract
A stage for mounting a substrate thereon, includes: an electrostatic chuck configured to attract the substrate; a base having a first region on which the electrostatic chuck is supported and a second region on which an edge ring arranged around the substrate is supported, the first region and the second region being divided by a groove extending in an annular shape; and a shield provided in the groove and configured to thermally separate the first region and the second region.
Claims13
A stage for mounting a substrate thereon, the stage comprising:
- an electrostatic chuck configured to attract the substrate;
- a base having a first region on which the electrostatic chuck is supported and a second region on which an edge ring arranged around the substrate is supported, the first region and the second region being divided by a groove extending in an annular shape;
- and
- a shield provided in the groove and configured to thermally separate the first region and the second region.
1 more element
A plasma processing apparatus, comprising:
- a stage for mounting a substrate thereon, the stage further comprising:
- an electrostatic chuck configured to attract the substrate;
- a base having a first region on which the electrostatic chuck is supported and a second region on which an edge ring arranged around the substrate is supported, the first region and the second region being divided by a groove extending in an annular shape;
- and
- a shield provided in the groove and configured to thermally separate the first region and the second region.
2 more elements
Dependencies are inferred from the claim text.