Pulsed-voltage hardware assembly for use in a plasma processing system

A pulsed-voltage subsystem assembly, comprising:

• a pulsed-voltage-generating unit enclosure, comprising
• a first pulsed-voltage waveform generator electrically coupled to a first generator output coupling assembly;
• and
• a second pulsed-voltage waveform generator that is electrically coupled to a second generator output coupling assembly;
• a junction box enclosure, comprising:
• a first bias compensation module compartment comprising:
• a first blocking capacitor electrically coupled between a first bias compensation module output coupling assembly and the first generator output coupling assembly;
• and
• a first DC power supply having a positive terminal and a negative terminal, wherein the positive terminal or the negative terminal is electrically coupled to the first bias compensation module output coupling assembly;
• a second bias compensation module compartment, comprising:
• a second blocking capacitor electrically coupled between a second bias compensation module output coupling assembly and the second generator output coupling assembly;
• and
• a second DC power supply having a positive terminal and a negative terminal, wherein the positive terminal or the negative terminal is electrically coupled to the second bias compensation module output coupling assembly;
• and
• a radio frequency filter compartment, comprising:
• a first radio frequency filter assembly electrically coupled between a first radio frequency filter output coupling assembly and the first bias compensation module output coupling assembly;
• and
• a second radio frequency filter assembly electrically coupled between a second radio frequency filter output coupling assembly and the second bias compensation module output coupling assembly,
• wherein
• the pulsed-voltage subsystem assembly is configured to be coupled to a plasma processing chamber,
• the first radio frequency filter output coupling assembly is configured to be electrically coupled to a first electrode disposed in the plasma processing chamber, and
• the second radio frequency filter output coupling assembly is configured to be electrically coupled to a second electrode disposed in the plasma processing chamber.