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US 2022/0037087 A1Published application
Mlcc module and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJae Seok YI, Jung Min KIM, Chang Hak CHOI, Bon Seok KOO, Byung Woo KANG, Hae Sol KANG, San KYEONG, Jun Hyeon KIM
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