Molded Interconnect Device
AssigneeTicona LLC
InventorYoung Shin Kim
Life of this patent
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Abstract
A molded interconnect device that comprises a substrate and conductive elements disposed on the substrate is provided. The substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix. The mineral filler has an average diameter of about 25 micrometers or less. The polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further exhibits a surface resistivity of about 1×1014 ohm or more.
Claims27
A molded interconnect device comprising:
- a substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix, wherein the mineral filler has an average diameter of about 25 micrometers or less, wherein the polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further wherein the polymer composition exhibits a surface resistivity of about 1×1014 ohm or more as determined in accordance with IEC 62631-3-1:2016;
- and
- conductive elements disposed on the substrate.
Dependencies are inferred from the claim text.